General cell phone maintenance device, rotating fixed design, no rebound, fixed firmly! The design has three adjustable distances.
Prevents clamps from moving during use, special non-slip pad, to allow heating. Let the hot air discharge more efficiently. Add a heat sink to the bottom of the clamp.
The rotating shaft locks the motherboard or IC more efficiently, attaches well without bounce.
The mount also supports the IC type fasteners attached to remove the back glue, the clamp is designed to bear the force of the IC beam, which can hold the empty parts of IC well and prevent the IC from breaking when removing black glue.
The device can be set at a different distance from the high, middle and low levels. It is necessary to loosen the two screws as the bottom, move the mounting plate to the appropriate gear position, and then tighten the bottom screws to lock it.